| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for carrying a substrate preventing the generation of the positional displacement of the substrate in the carrying of the substrate and being capable of optimizing the production efficiencies of all kinds of the substrates. SOLUTION: A device 3 for carrying wafers has a carrying arm 13 arranged in an L/M 12, surface-roughness sensors 30A to 30D arranged in front of shutters 37A to 37D mounted in response to hoops 10A to 10D housing the semiconductor wafers W on the side face of the L/M 12, and a control unit 36 controlling the operations of each component of the device 3 for carrying the wafers. The surface-roughness sensors 30 measure the surface roughnesses of the rears of the semiconductor wafers W extracted from the hoops 10 by the carrying arm 13. The control unit 36 sets the carrying speeds of the semiconductor wafers W by the carrying arm 13 on the basis of the measured surface roughnesses. COPYRIGHT: (C)2006,JPO&NCIPI
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