| 摘要 |
A photosensitive bonding package structure mainly comprising a substrate, a photosensitive device and a plurality of bumps is provided. The substrate has a light incident area located near the central area of the substrate. The photosensitive device has a photosensitive area in a position corresponding to the light incident area so that the photosensitive device can receive a beam of incident light passing through the opening. In addition, the substrate has a plurality of inner contacts and corresponding outer contacts. Pads on the photosensitive device are connected to the inner contacts through bumps so that the electrical signals resulting from illuminating the photosensitive area is transmitted to the substrate.
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