| 摘要 |
PROBLEM TO BE SOLVED: To provide a hoop keeping pure atmosphere even when a wafer after treated and a wafer before treated are intermingled without piling corrosive gas such as P, Cl<SB>2</SB>or the like in the hoop. SOLUTION: The hoop used for a wafer carrier in a semiconductor manufacturing process is a cell for laying a ware prepared inside the shell of the above-mentioned hoop, a wafer support for laying the wear inside the shell of the above-mentioned cell formed in box type profile is prepared, a partition is prepared between the above-mentioned wear supports so that the wear is laid inside a partitioned box type space, the above-mentioned cell has conductivity or is processed by antistatic treatment, the upper surface of the above-mentioned shell, the above-mentioned shell, and the lower surface of the above-mentioned shell are constituted using conductive component, and an opening is prepared at an opposite side facing a wafer in/out side of the above-mentioned cell. COPYRIGHT: (C)2006,JPO&NCIPI |
