| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a semiconductor device with an adhesion sheet, an adhesion sheet, and an adhesion sheet integral with a dicing tape having heat resistance, moisture resistance and excellent in workability required in the case of mounting a semiconductor device to the support member for mounting a semiconductor. SOLUTION: The manufacturing method of a semiconductor device with an adhesion sheet comprises a process (1) for adhering an adhesion sheet at 0-170°C selected from a group consisting of an adhesion sheet, a dicing tape, and an adhesion sheet integral with a dicing tape; a process (2) for reforming a wafer so as to change it into a sectile condition, or cutting it; a process (3) for reforming an adhesion sheet so as to change it into a sectile condition; furthermore, a process (4) for cutting an adhesion sheet by expanding; and a process (5) for making a semiconductor device with an adhesion sheet into piece-form by picking up. An adhesion sheet and an adhesion sheet integral with a dicing tape are obtained by using the above manufacturing method. COPYRIGHT: (C)2006,JPO&NCIPI |
