| 摘要 |
PROBLEM TO BE SOLVED: To realize highly reliable connection and heat dissipation effect superior to a prior art heat dissipation structure without raising manufacturing costs in a printed wiring board. SOLUTION: In designing the pad of a surface mounted component 5 that generates heat, solid wiring 1 with a size larger than a heat dissipation pad is formed on the mounting surface of the component 5, and solid wiring 4 is formed on the rear surface. An SR 8 is applied at the center of the solid wiring 1 and along upper and lower peripheries, and the heat dissipation pad is divided to form divided pads 2 and an area that is not soldered at the center of the divided pad. Through-holes 3 are provided in the area located at the center and not soldered and in the upper and lower peripheries of the divided pads 2 to connect the solid wiring 1 on the surface of the PWB 10 and the solid wiring 4 on the rear surface of the same. In an SMT component mounting process, a cream solder is supplied only to the divided pad 2, while the cream solder is prevented from flowing into the through-holes at the center between the divided pads 2. COPYRIGHT: (C)2006,JPO&NCIPI |
