发明名称 |
WIRE SAW, PLASMA TREATMENT DEVICE, AND WIRE MANUFACTURE METHOD |
摘要 |
PROBLEM TO BE SOLVED: To keep the behavior of a wire stable by attaching slurry more uniformly on a wire. SOLUTION: A wire saw is constructed so as to cut the wire W with a work 28 pressed against the wire while feeding slurry to the wire W running at a high speed with slurry feeders 36A, 36B. Near the slurry feeders 36A, 36B, there are provided plasma treatment devices 42A, 42B for applying prescribed plasma treatment for activating a wire surface by means of plasma for the wire W. COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2006075941(A) |
申请公布日期 |
2006.03.23 |
申请号 |
JP20040262395 |
申请日期 |
2004.09.09 |
申请人 |
TOYO ADVANCED TECHNOLOGIES CO LTD;ADTEC PLASMA TECHNOLOGY CO LTD |
发明人 |
ABE YOSHINORI;NAKATANI TATSUYUKI;HAMAZAKI TATSUMI;OKAMOTO KEIJI;FUJII SHUITSU;SHIDA AKINORI;URAYAMA TAKUYA;FUJIOKA KAZUYA |
分类号 |
B24B27/06;B24B57/02;B28D5/04;H01L21/304 |
主分类号 |
B24B27/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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