发明名称 WIRE SAW, PLASMA TREATMENT DEVICE, AND WIRE MANUFACTURE METHOD
摘要 PROBLEM TO BE SOLVED: To keep the behavior of a wire stable by attaching slurry more uniformly on a wire. SOLUTION: A wire saw is constructed so as to cut the wire W with a work 28 pressed against the wire while feeding slurry to the wire W running at a high speed with slurry feeders 36A, 36B. Near the slurry feeders 36A, 36B, there are provided plasma treatment devices 42A, 42B for applying prescribed plasma treatment for activating a wire surface by means of plasma for the wire W. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006075941(A) 申请公布日期 2006.03.23
申请号 JP20040262395 申请日期 2004.09.09
申请人 TOYO ADVANCED TECHNOLOGIES CO LTD;ADTEC PLASMA TECHNOLOGY CO LTD 发明人 ABE YOSHINORI;NAKATANI TATSUYUKI;HAMAZAKI TATSUMI;OKAMOTO KEIJI;FUJII SHUITSU;SHIDA AKINORI;URAYAMA TAKUYA;FUJIOKA KAZUYA
分类号 B24B27/06;B24B57/02;B28D5/04;H01L21/304 主分类号 B24B27/06
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