发明名称 MANUFACTURING METHOD OF HYBRID INTEGRATED CIRCUIT DEVICE AND ETCHANT LEAVING DEVICE WITH ROLLER
摘要 PROBLEM TO BE SOLVED: To prevent a substrate from being damaged by providing a roller with irregularities and carrying the substrate with the use of this roller so that the roller does not come into contact with the entire surface of the substrate. SOLUTION: Since the roller 32 does not come into contact with the entire surface of the substrate by providing the roller with irregularities, the substrate is prevented from being damaged. Further, when the roller 32 with irregularities is rolled under the condition where there is an etchant on the substrate, the etchant can be left on the substrate while draining of extra etchant. Therefore iron chloride etchant provided between wirings is generated in CuClx and Ni can be selectively etched. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006080566(A) 申请公布日期 2006.03.23
申请号 JP20050337535 申请日期 2005.11.22
申请人 SANYO ELECTRIC CO LTD 发明人 IGARASHI YUUSUKE
分类号 H05K3/06;C23F1/00 主分类号 H05K3/06
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