| 摘要 |
PROBLEM TO BE SOLVED: To cut a tape stuck to the surface of a thin-type wafer in accordance with the size of a wafer without breaking the wafer and to laminate the wafer and a supporting substrate via an adhesive tape without breaking the thin type wafer. SOLUTION: An adhesive tape 31 which is larger than the thin type wafer 41 is stuck to the surface thereof. A blade 101 of a tape cutter is abutted to a peripheral edge of a wafer holding stand 102 keeping it oblique as if falling to the wafer 41 side. In the state, the blade 101 of the tape cutter is moved along the peripheral edge of the wafer holding stand 102, thus cutting the adhesive tape 31. Thereafter, the supporting substrate 32 is stuck to the adhesive tape 31. COPYRIGHT: (C)2006,JPO&NCIPI
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