发明名称 CONDUCTIVE PASTE AND MANUFACTURING METHOD OF SAME
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste for forming a thick film not generating defective printing by removing lump-shaped impurities with a simple process without accompanying any alteration of the composition of the conductive paste and rheology thereof, and to provide a manufacturing method of the same. SOLUTION: The conductive paste is manufactured by filtrating the conductive paste containing metal powder and an organic vehicle as main components by a filter with a sieve opening of not less than 30μm and not more than 50μm. A viscosity of the conductive paste of 400 Pa s or higher is lowered to 400 Pa s or less by applying a shearing stress on the conductive paste by utilizing a thixotropic property thereof, and the paste is filtrated. Further, an electronic circuit, having a substrate on which the conductive paste is printed, is provided. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006079912(A) 申请公布日期 2006.03.23
申请号 JP20040261782 申请日期 2004.09.09
申请人 SUMITOMO ELECTRIC IND LTD 发明人 YAMAKAWA SHINKO;SHIMODA KOHEI
分类号 H01B13/00;H01B1/22 主分类号 H01B13/00
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