发明名称 ELECTRONIC COMPONENT ACCOMMODATING PACKAGE AND SEMICONDUCTOR DEVICE USING IT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an electronic component accommodating package suppressing the harmful effect of noise generated from a gland wiring layer connected to electronic components accommodated inside and capable of normally and stably operating the electronic components accommodated inside for a long period of time. <P>SOLUTION: The electronic component accommodating package includes: a substrate 1 having a mounting section of a signal wiring layer 2, and a plurality of gland wiring layers 4, 5 sandwiching this layer 2 from the upper and the lower sides and the electronic components 6; and a lid body 7 having a recess for accommodating the electronic components 6 inside. The plurality of gland wiring layers include: the first gland wiring layer 4 to which a gland of the electronic component 6 is electrically connected, and which sandwiches the signal wiring layer 2 from the upper and lower sides; and the second gland wiring layer 5 which is grounded through a separate external terminal electrically independent of the first gland wiring layer 4, and disposed so as to sandwich the signal wiring layer 2 and also to sandwich from the upper and lower sides, the first gland wiring layer 4 positioned on and under the layer 2. A metal layer 8 which is a conductive internal wall of the lid body 7 is electrically connected to the second wiring gland layer 5. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006080574(A) 申请公布日期 2006.03.23
申请号 JP20050350622 申请日期 2005.12.05
申请人 KYOCERA CORP 发明人 KABUMOTO MASANAO
分类号 H01L23/00;H01L23/02;H01L23/12 主分类号 H01L23/00
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