SEMICONDUCTOR WAFER SUPPORTING PLATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor wafer supporting plate and a method for manufacturing the semiconductor device capable of easily and satisfactorily conducting a process such as a plating process of a through-hole portion of a semiconductor wafer, and capable of manufacturing a satisfactory semiconductor device with a good manufacturing efficiency. SOLUTION: The semiconductor wafer supporting plate 1 is formed in an approximately circular plate from a glass or a resin capable of transmititng an ultraviolet light with its outer diameter larger than that of the semiconductor wafer 10 supported by the plate 1. A plurality of openings 2 are formed in the semiconductor wafer supporting plate 1 corresponding to a plurality of through-holes 11 formed in the semiconductor wafer 10. The opening areas of these openings 2 are larger than that of the through-holes 11, that is, the opening diameters are set larger. COPYRIGHT: (C)2006,JPO&NCIPI