| 摘要 |
PROBLEM TO BE SOLVED: To provide a cold plate performing required cooling of a self-heat generating electronic component located at an arbitrary position on the plate body 11 of the cold plate 10 without causing malfunction or damage of the electronic component. SOLUTION: The cold plate 10 comprises plate bodies 11 and 12 in which a refrigerant channel 14 is formed, and heat-exchanging fins 11a and 12a provided in the refrigerant channel 14 and fixed thermo-conductively with the plate bodies 11 and 12 wherein the heat-exchanging fins 11a and 12a form a cascade channel such that the refrigerant flow resistance is distributed unequally from the refrigerant inlet 15 of the refrigerant channel 14 toward the refrigerant outlet 16 side. COPYRIGHT: (C)2006,JPO&NCIPI |
