| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multi-layer printed wiring board where a wrinkle is not formed on a copper foil to be an outer layer, and to provide the multi-layer printed wiring board. SOLUTION: The method for manufacturing a multi-layer printed wiring board includes the following process. A copper foil, a plurality of inner layer boards where a circuit is previously formed, and prepregs which are sandwiched between each inner layer board and between the inner layer board and the copper foil, are positioned and are fixed, then are heated and pressed to form laminated layers. An organic solvent is dropped in the predetermined positions of the copper foil, the inner layer board, and the prepreg when positioning the copper foil, inner layer board, and prepreg, to solve the resin on the surface of the prepreg and fix them. COPYRIGHT: (C)2006,JPO&NCIPI |
