| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for forming terminal electrodes 2, 3 of uniform thickness on both end surfaces 1a, 1b of a chip type electronic component 1. SOLUTION: The electronic component 1 is filled in each through-hole 21a of an orientation board 21 by vacuum aspiration and extruded towards a first holder 11. The first holder 11 holds the electronic component 1 by absorbing one end face 1a thereof. After the orientation board is removed in this state, the other end surface 1b of each chip type electronic component is formed with a terminal electrode 3. Then, part of the other end surface 1b of each chip type component is pushed in the keyhole 31c of a second holder 31, thereby passing the electronic component 1 from the first holder to the second holder. In this state, the one end surface 1a of each electronic chip type electronic component is formed with a terminal electrode 2. COPYRIGHT: (C)2006,JPO&NCIPI
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