<p>A polishing liquid for CMP comprised of a composition loaded with, for example, a surfactant, a protective film forming agent and an inorganic salt capable of imparting a dissolution accelerating activity to enlarge a difference between polishing speed under non-load and polishing speed under load. By virtue of this polishing liquid for CMP, there can be simultaneously accomplished a speed increase for enhancing CMP productivity and wiring miniaturization/wiring planarization for layer multiplication.</p>
申请公布号
WO2006030595(A1)
申请公布日期
2006.03.23
申请号
WO2005JP14878
申请日期
2005.08.09
申请人
HITACHI CHEMICAL COMPANY, LTD.;MABUCHI, KATSUMI;AKAHOSHI, HARUO;KAMIGATA, YASUO;HABIRO, MASANOBU;ONO, HIROSHI