CHIP-ON-CHIP SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To realize both the suppress of lowering of the transmission rate of a signal between chips and the reduction in the area of the chips with respect to semiconductor integrated circuit devices adopting SiP mounted with the chips of different supply voltages.

SOLUTION: A COC type semiconductor integrated circuit device 10 comprises a chip 1 which operates by supply voltage VDD1, and a chip 2 which is connected to the chip 1 by chip connection bumps 3 and which operates by supply voltage VDD2 higher than supply voltage VDD1. The chip 2 includes an output buffer 24 for sending a sending signal S2→1whose signal level coincides with the supply voltage VDD2 to the chip 1 via one bump in the connection bumps 3. On the other hand, the chip 1 is constituted so that the signal level of sending signal S2→1may be converted so as to input the converted signal S2→1' into an internal circuit 11.

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