| 摘要 |
PROBLEM TO BE SOLVED: To provide an application/developing device for removing particles stuck to a peripheral edge part of a semiconductor wafer (including removal of a water-repellent protection film used for repelling liquid at the time of liquid immersion exposure) with a simple structure after liquid immersion exposure and before development. SOLUTION: A cleaning unit is arranged in an interface station of the application/developing device. The cleaning unit sandwiches a peripheral part of the wafer by a U-shaped part formed to surround the peripheral edge part of the wafer, discharges cleaning liquid to the peripheral edge part of the wafer from an upper side nozzle part and a lower side nozzle part, which are disposed in the U-shaped part and sucks it from a suction port on a side part of the U-shaped part. Thus, the particles stuck to the wafer are securely removed with such structure. COPYRIGHT: (C)2006,JPO&NCIPI |
