发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device wherein a pretreatment step is provided as pretreatment for forming an insulating film appropriately on a base insulating film so as to obtain sufficient effect for a short time. SOLUTION: When an insulating film is subjected to be formed on the surface of a semiconductor substrate wherein a base insulating film is formed on the entire surface by the CVD method; the surface layer of the base insulating film is etched by a plasma of a fluorine-containing gas, a plasma of a nitrogen gas or an ammonia gas is given thereto, and then the insulating film is formed by the CVD method. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006080128(A) 申请公布日期 2006.03.23
申请号 JP20040259527 申请日期 2004.09.07
申请人 KAWASAKI MICROELECTRONICS KK 发明人 HIRANO SHINJI
分类号 H01L21/316;H01L21/768 主分类号 H01L21/316
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