| 摘要 |
An electronic component-mounted structure includes an electronic component having a bump electrode, the bump electrode including a projection made of a first resin and a conductive film covering at least a top of the projection; a substrate having a connecting terminal; and a second resin filling the space between the electronic component and the substrate, wherein the bump electrode abuts against the connecting terminal, and wherein the relationship T0<Tgr<Tgb is satisfied, where T0 is an operating temperature of the electronic component mounted on the substrate, Tgb is a glass transition temperature of the first resin, and Tgr is a glass transition temperature of the second resin.
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