Method for polishing substrate

摘要

In a method for polishing a substrate, a substrate placed on a polishing pad bonded onto a platen is polished while the temperature of a surface of the polishing pad is monitored. An index of the amount of the substrate polished is calculated based on the monitored temperature of the polishing pad surface. When the calculated index of the amount of the substrate polished is below a previously set value, the substrate is detected as an abnormally polished substrate.