Micromechanical assembly part structuring method, involves removing material of micromechanical assembly part e.g. semiconductor substrate, by laser treatment that produces diaphragm in assembly part

摘要

The method involves removing material of a micromechanical assembly part e.g. semiconductor substrate (200), by laser treatment, where the micromechanical assembly part is provided with a layer of silicon nitride. The laser treatment produces a diaphragm (240) in the micromechanical assembly part. The material removal takes place in dependence upon wavelength, energy and pulse width of laser. An independent claim is also included for a device for structuring of a micromechanical assembly part.