| 摘要 |
An apparatus for use in a chemical mechanical planarization system (100) is provided. The apparatus includes a fluid displacing device and a fluid delivery device. The fluid displacing device is capable of being positioned at a proximate location over a polishing pad (101), the fluid displacing device configured to displace at least part of a first fluid from a region of the polishing pad (101). The fluid delivery device (103) is capable of replacing the displaced first fluid with a second fluid at the region of the polishing pad, the second fluid being different than the first fluid. A method of controlling properties of a film present over a polishing pad (101) surface is also provided. Further provided is an apparatus that is capable of delivering a fluid over the polishing pad, where the delivery is at a proximate location over the polishing pad surface. The apparatus should further be capable of removing at least part of the fluid from over the polishing pad surface. The removing is configured to occur at a proximate location over the polishing pad surface and adjacent to the delivery of the fluid.
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