发明名称 WORK POLISHING METHOD AND POLISHING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a work polishing method and polishing device capable of polishing work having longitudinal dimensions longer than ring band width while ensuring flatness of the work. <P>SOLUTION: In the work polishing method, the work 42 of a rectangular parallel flat surface optical component having length 1.2 times longer than the ring band width in a rind band area of a ring polisher disc 5 is set in a work holding plate 39 while the posture of the work 42 is regulated. A machined surface 42a of the work 42 is contacted with a ring poilsher surface 5a of the ring polisher disc 5. Under a condition that work 39 is kept in a constant direction in a non-rotating state while rotating the ring polisher disc 5, a longitudinal direction of the work 39 is made to carry out tracking in a direction intersecting a rotating direction of the ring polisher disc 5, in the direction intersecting the rotating direction of the ring polisher disc 5, thereby polishing a machined surface 39a of the work 39. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006075986(A) 申请公布日期 2006.03.23
申请号 JP20050339649 申请日期 2005.11.25
申请人 TOPCON CORP 发明人 KUROSAWA HIROSHI
分类号 B24B37/10;B24B47/16 主分类号 B24B37/10
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