发明名称 PRETREATMENT METHOD FOR ELECTROLESS PLATING, AND PRETREATMENT LIQUID USED THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a pretreatment method for an electroless plating which employs a wet process low in cost and easy in handleability, can carry a catalyst on the surface of a nonconductive substance while keeping its surface substantially smooth, and can reduce an environmental load. SOLUTION: The pretreatment method to electroless plating is characterized in that a compound (A) having groups capable of a chemical bond with catalyst nuclei in electroless plating is adsorbed on the surface of a nonconductive substance by a hydrogen bond. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006077289(A) 申请公布日期 2006.03.23
申请号 JP20040262078 申请日期 2004.09.09
申请人 EBARA UDYLITE KK 发明人 TAKATOKU MAKOTO
分类号 C23C18/18 主分类号 C23C18/18
代理机构 代理人
主权项
地址