| 摘要 |
The present invention provides a metallized substrate that has little warping and a fine, smooth surface. In the metallized substrate of the present invention, a conductive film is formed by spraying on the surface of a ceramic substrate or a composite substrate of a ceramic and a metal. The surface roughness of the conductive film formed by the spraying is preferably Ra<=1.0 mum. The surface of the conductive film may be a machined surface. The spraying is preferably arc spraying, plasma spraying, or flame spraying.
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