发明名称 METHOD FOR MANUFACTURING IMAGING DEVICE ASSEMBLY AND MOUNTING MEMBER USED THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To solve the problems wherein the operation of an adhesive coating device and an ultraviolet ray irradiation device is limited since a clamping member for fixing a mounting member in which an imaging device is mounted to a tool and a location coated with an ultraviolet curing resin adhesive are located closely, in a method for manufacturing an imaging device assembly in which a conventional imaging device is fixed to the mounting member by an adhesive, and hence a location coated with an adhesive is limited and productivity becomes poor and uneconomical. <P>SOLUTION: The mounting member 60 used for manufacturing the imaging device assembly body 56 is provided with clamping sections 63, 64, 65 connected by disconnection members 75, 76, 77. The clamping sections 63, 64, 65 are clamped by clamping members 92, 93 and are fixed to a lifter 91 of a tool 81, thus creating space having improved working efficiency near a location coated with an ultraviolet curing resin adhesive for connecting the mounting member 60 to the imaging device 61. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006080667(A) 申请公布日期 2006.03.23
申请号 JP20040260078 申请日期 2004.09.07
申请人 SONY CORP 发明人 MAEDA IPPEI
分类号 H01L27/14;H04N5/225;H04N5/335 主分类号 H01L27/14
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