| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric apparatus where durability is improved by reducing occurrence of thermal stress. SOLUTION: The thermoelectric apparatus 10 comprises a thermoelectric module 11 and a heat sink material 12. The thermoelectric module 11 is formed by fitting lower electrodes 15 and 15a and an upper electrode 16 respectively to the prescribed places on opposing surfaces of a lower-side insulation substrate 13 and an upper-side insulation substrate 14 comprising a divided insulation substrate 14a etc. both of which are arranged opposing each other, and connecting the end face of a thermoelectric element 17 respectively to the lower electrodes 15 and 15a and the upper electrode 16. Then, a groove 12a is formed on a surface opposing the divided insulation substrate 14a at the heat sink material 12, and this heat sink material is connected to the divided insulation substrate 14a through an epoxy-based adhesive 19. The groove 12a of the heat sink material 12 is formed along a gap 14e at the divided insulation substrate 14a etc. COPYRIGHT: (C)2006,JPO&NCIPI
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