| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device for reducing the difference in the length between wires at the corner of a semiconductor chip, and to provide a method for packaging the semiconductor device. SOLUTION: Lead frames 2a, 2c, 2b are arranged at an equal interval at the outer periphery of a package 1 formed arcuately, and the interval of the outer leads of respective lead frames 2a, 2c, 2b on the outer-periphery side of the package is equal. And the inner leads of respective lead frames 2a, 2c, 2b are arranged at the outer periphery of the package 1 or nearly concentrically with the outer leads of respective lead frames 2a, 2c, 2b. And the capacitive coupling by an island 3a and the grounding pattern of a printed-wiring board reduces the ground impedance of the semiconductor device 100. COPYRIGHT: (C)2006,JPO&NCIPI |
