发明名称 CIRCUIT BOARD AND ITS MANUFACTURING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To obtain a circuit board having an even distance between electrodes which prevents shortening between a first electrode and a second electrode and improves reliability by ensuring an operating time, and to obtain its manufacturing method and electronic equipment using the same. <P>SOLUTION: The circuit board 1 is provided with a first conductive part forming substrate 104 having a first substrate 102 and the first electrode 103, a second conductive part forming substrate 107 having a second substrate 105 and the second electrode 106, and a dielectric part 2 interposed between the substrate 104 and the substrate 107. The dielectric part 2 is provided with a dielectric film 3 which does not melt in thermocompression bonding and a bonded insulator 4 which melts in the thermocompression bonding. The surface of the film 3 is treated to improve wettability, whereby the insulator 4 that has melted in the thermocompression bonding is liable to adhere to the film 3. The distance between the electrode 103 and the electrode 106 can be made even by allowing the film 3 to interpose therebetween. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006080561(A) 申请公布日期 2006.03.23
申请号 JP20050331686 申请日期 2005.11.16
申请人 MITSUBISHI ELECTRIC CORP 发明人 UCHIUMI SHIGERU;FUJIOKA HIROFUMI;OKA SEIJI;TSURUSE HIDENORI;KASE TAIICHI;MURAKI KENJI
分类号 H05K3/46;H01L23/12 主分类号 H05K3/46
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