| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for cutting a protective tape that chips are prevented from being produced when the protective tape of a semiconductor wafer is cut. SOLUTION: This method for cutting the protective tape of the semiconductor wafer 2, consisting of a step of affixing the protective tape 4 to a surface of the semiconductor wafer 2 before processing of a rear surface of the semiconductor wafer 2 and cutting the protective tape 4 along an outer contour of the semiconductor wafer 2, includes a step of cutting the protective tape 4 along the outer contour of the semiconductor wafer 2 while some tension is being radially added toward the peripheral direction of the semiconductor wafer 2 after the protective tape 4 is affixed to the surface of the semiconductor wafer 2. COPYRIGHT: (C)2006,JPO&NCIPI |
