| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin-walled member light in weight, small in the difference between a semiconductor device and itself, and high in thermal conductivity, thus suitable for a substrate material for mounting a semiconductor device. SOLUTION: This aluminum-ceramic composite is obtained by the steps of mixing an organic binder and/or inorganic binder with at least a kind of ceramic powder selected from the group consisting of silicon carbide, silicon nitride and aluminum nitride; preparing a sheet-like molded product of≤1.5 mm thickness by extrusion molding or doctor-blade forming of the mixture; heat-treating the molded product at 800-1,200°C for 10 minutes to 2 hours to obtain a ceramic porous body with 20-60% porosity; preheating the ceramic porous body at≥550°C temperature; and infiltrating a molten metal mainly comprising aluminum into pore parts of the ceramic porous body applying pressure of≥20 MPa. COPYRIGHT: (C)2006,JPO&NCIPI
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