Power semiconductor module, has cavity region arranged between two heat sink sections, where power semiconductor- components are arranged in cavity region so that semiconductor devices are placed in thermal contact with heat sink

摘要

The module has a heat sink with two heat sink sections. A cavity region is arranged between two heat sink sections, where power semiconductor- components are arranged in the cavity region so that semiconductor devices are placed in thermal contact with the heat sink. The semiconductor components consist of terminal contacts that are inserted to their electrical contacts. The semiconductor components have a supporter (90) with metallization.