发明名称 |
ELECTRO POLISHING COMBINED ELECTRIC PLATING APPARATUS AND ELECTROLESS PLATING APPARATUS USING THE SAME |
摘要 |
<p>Disclosed are an electro polishing combined electric plating apparatus and an electroless plating apparatus using the same that that can form a plating film on a workpiece shaped in a pipe made of a material selected from the group consisting of a noble metal, a stainless steel and a molybdenum steel. The plating apparatus includes: an electro polishing combined electric plating apparatus including: a first transferring means transferring a plating target along an inner passage of a workpiece shaped in a pipe dipped in an electrolyte; and a workpiece transferring unit applying a positive voltage to the plating target connected with the transferring means and a negative voltage to the workpiece or applying a negative voltage to the plating target and a positive voltage to the workpiece and transferring the workpiece; and an electroless plating apparatus for forming at least one layer of: electroless plating film on a surface of the workpiece which has bee subject to an electro polishing and/or an electro plating.</p> |
申请公布号 |
WO2006030998(A1) |
申请公布日期 |
2006.03.23 |
申请号 |
WO2004KR02658 |
申请日期 |
2004.10.16 |
申请人 |
BUKWANG TECHNOLOGY CO., LTD.;YOO, YONG-SANG |
发明人 |
YOO, YONG-SANG |
分类号 |
C25D5/18;C23C18/16;C23C18/18;C25D5/04;C25D5/08;C25D7/04;C25D17/10;C25F7/00;(IPC1-7):C25D5/18 |
主分类号 |
C25D5/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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