发明名称 ELECTRO POLISHING COMBINED ELECTRIC PLATING APPARATUS AND ELECTROLESS PLATING APPARATUS USING THE SAME
摘要 <p>Disclosed are an electro polishing combined electric plating apparatus and an electroless plating apparatus using the same that that can form a plating film on a workpiece shaped in a pipe made of a material selected from the group consisting of a noble metal, a stainless steel and a molybdenum steel. The plating apparatus includes: an electro polishing combined electric plating apparatus including: a first transferring means transferring a plating target along an inner passage of a workpiece shaped in a pipe dipped in an electrolyte; and a workpiece transferring unit applying a positive voltage to the plating target connected with the transferring means and a negative voltage to the workpiece or applying a negative voltage to the plating target and a positive voltage to the workpiece and transferring the workpiece; and an electroless plating apparatus for forming at least one layer of: electroless plating film on a surface of the workpiece which has bee subject to an electro polishing and/or an electro plating.</p>
申请公布号 WO2006030998(A1) 申请公布日期 2006.03.23
申请号 WO2004KR02658 申请日期 2004.10.16
申请人 BUKWANG TECHNOLOGY CO., LTD.;YOO, YONG-SANG 发明人 YOO, YONG-SANG
分类号 C25D5/18;C23C18/16;C23C18/18;C25D5/04;C25D5/08;C25D7/04;C25D17/10;C25F7/00;(IPC1-7):C25D5/18 主分类号 C25D5/18
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