| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a PWB which can prevent solder from becoming brittle, when a large amount of gold on a surface of an electrode is deposited into the solder, and cause some of two or more electrodes to function properly as contact electrodes. <P>SOLUTION: In a PWB 150, where a plurality of electrodes are formed on a surface of a substrate 153 made of glass epoxy with copper wires, non-Au electrodes 151 that does not have provided Au surface layers made of gold and Au electrodes 152, including Au surface layers are both formed as the electrodes. An oxidation suppressing film 154 is formed on the surface of the non-Au electrode 151. The oxidation suppressing film 154 is made of flux which is a material different from gold. The oxidation suppressing films 154 suppress oxidation of the non-Au electrodes 151, so that the PWB 150 can be prepared in advance. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
