发明名称 SOLID-STATE ELEMENT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a solid-state element device in which an expected effect can be actually obtained by performing glass sealing after extracting and solving a problem for realizing inorganic material sealing work, further, humidity resistance is improved, and losing of transparency in glass sealing and cloudiness in characteristic evaluation do not occur. <P>SOLUTION: In a light emitting device 1 as a solid-state element device, a glass sealing part 6 is formed by performing hot press working of low fusing point glass of P<SB>2</SB>O<SB>5</SB>-ZnO-Li<SB>2</SB>O in a predetermined atmosphere for a glass containing Al<SB>2</SB>O<SB>3</SB>substrate 3 with a GaN LED element 2 mounted thereon. The glass sealing part 6 is worked at a temperature sufficiently lower than the crystal growth temperature of the GaN LED element 2. Thus, the light emitting device 1 can be obtained with humidity resistance and transparency and without occurrence of thermal element destruction. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006080317(A) 申请公布日期 2006.03.23
申请号 JP20040263098 申请日期 2004.09.09
申请人 SUMITA OPTICAL GLASS INC;TOYODA GOSEI CO LTD 发明人 SAWANOBORI SHIGETO;OTSUKA MASAAKI;AIDA KAZUYA;WATABE HIROMI;SUEHIRO YOSHINOBU
分类号 H01L33/32;H01L33/44;H01L33/56;H01L33/62 主分类号 H01L33/32
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