| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulating resin layer high in mechanical strength and excellent in dielectric characteristics, an insulating resin layer with a carrier, and a multi-layer printed circuit board using the resin layers. SOLUTION: The insulating resin layer used in the multi-layer printed circuit board is composed of a first layer with a dielectric constant of 3.2 or below and a second layer with a linear expansion coefficient of 40 ppm/°C or below, where at least one layer of each layer is laminated. In the multi-layer printed circuit board, the insulating resin layer is laminated on at least one surface of an inner layer circuit board, heated, and pressurized. COPYRIGHT: (C)2006,JPO&NCIPI |
