发明名称 POLYIMIDEBENZOXAZOLE FILM
摘要 PROBLEM TO BE SOLVED: To provide a film composed of an organic material having slight temperature dependence and all of heat resistance, responsiveness to high frequency and flexibility at higher levels. SOLUTION: The polyimidebenzoxazole film is a film consisting essentially of a polyimidebenzoxazole obtained by reacting aromatic diamines having a benzoxazole structure with aromatic tetracarboxylic anhydrides and is characterized as having the ratioε<SB>65</SB>/ε<SB>D</SB>of the dielectric constantε<SB>65</SB>at 100 GHz of the film subjected to humidity conditioning under constant-temperature and constant-humidity conditions of 20°C and 65%RH for 94 h and measured by a cavity resonance perturbation method to the dielectric constantε<SB>D</SB>at 100 GHz of the film vacuum dried under conditions of 120°C for 24 h and measured by the cavity resonance perturbation method within the range of 1.00-1.10. The moisture content evaporated during heating at 500°C for 10 s is≤5,000 ppm. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006077158(A) 申请公布日期 2006.03.23
申请号 JP20040263869 申请日期 2004.09.10
申请人 TOYOBO CO LTD 发明人 TSUTSUMI MASAYUKI;KAWAHARA KEIZO;YASUI JUN;MORINO MORIO
分类号 C08J5/18;C08L79/08 主分类号 C08J5/18
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