| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To increase a reliability by positively sealing a package for an electronic component in a method for hermetically sealing a base and a lid in the package by seam welding. <P>SOLUTION: The rectangular base 1 of a ceramic material provided with a metallic layer 8 is formed on its junction surface to a lid 2, the rectangular lid of a metallic material provided with a seal metal layer 11 is formed on its junction surface to a base, a piezoelectric vibration piece 13 is mounted to the base, the lid is mounted on the base, and the lid is temporarily welded by seam welding to the base on the side of a shorter side 2a in the rectangle of the lid. Thereafter, the lid is finally welded by seam welding to the base along the full periphery of the lid to thereby hermetically seal a package. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
