发明名称 ELECTRONIC COMPONENT PROCESS HANDLING EQUIPMENT, PROCESS HANDLING METHOD AND PROCESS HANDLING PROGRAM
摘要 <P>PROBLEM TO BE SOLVED: To provide the process handling technology that improves the productivity by shortening a carriage cycle, maintains low cost by minimizing additional mechanism, ensures long time for process handling and provides reliable electronic components. <P>SOLUTION: This process handling equipment comprises two process mechanisms 21 and 22 and multiple absorption nozzle 10 in transportation direction. It is also provided with a supply unit for feeding a semiconductor device S to an absorption nozzle 10 each time the absorption nozzle 10 stop multiple times. Nozzles 10, which comes to the corresponding positions of the process mechanisms 21 and 22 each time the nozzle stops, include a nozzle for passing the semiconductor device S to either of the process mechanisms 21 and 22 once per multiple stops and a nozzle for receiving the semiconductor device S treated once per multiple stops from the other of the above process mechanisms 21 and 22. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006080483(A) 申请公布日期 2006.03.23
申请号 JP20050159998 申请日期 2005.05.31
申请人 UENO SEIKI KK 发明人 IWAMOTO EIZUI;MATSUBARA KOJI;IURA KAZUHIKO
分类号 H01L21/50 主分类号 H01L21/50
代理机构 代理人
主权项
地址