发明名称 SEMICONDUCTOR PROBE EQUIPPED WITH RESISTANCE CHIP AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor probe where a resistance chip is formed at an end of a cantilever having no alignment margin, and to provide a manufacturing method therefor. SOLUTION: The semiconductor probe comprises the half quadrangular pyramid-like resistance chip 30 that is doped with a first impurity; the cantilever 41 where the resistance chip 30 is positioned on a free end thereof; a resistance region 36 at the tip end of the resistance chip 30, where the first impurity and a second impurity a different polarity from the first impurity are light doped; and a first electrode semiconductor region 32 and a second electrode semiconductor region 34, wherein the second impurity is heavily doped in the sloping surface of the resistance chip 30, and they are formed mutually separate, and electrically connected to the resistance region 36. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006078485(A) 申请公布日期 2006.03.23
申请号 JP20050258882 申请日期 2005.09.07
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 BOKU KOSHOKU;BAECK KYOUNG-LOCK;JUNG JU-HWAN;KO HYOUNG-SOO;PARK CHUL-MIN;HONG SEUNG-BUM
分类号 G01Q60/00;G01Q80/00;G01R1/067 主分类号 G01Q60/00
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