发明名称 Methods for measuring die temperature
摘要 Methods for measuring device temperature. In one example, device temperature may be determined by measuring a voltage across a diode arranged to provide electrostatic discharge protection for the die and calculating the die temperature using the voltage measured across the diode. Alternatively, other components on the die, not dedicated to temperature measurement may also be used to measure the die temperature.
申请公布号 US2006063285(A1) 申请公布日期 2006.03.23
申请号 US20040948600 申请日期 2004.09.23
申请人 MILLER JOSEPH P 发明人 MILLER JOSEPH P.
分类号 H01L21/66 主分类号 H01L21/66
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