NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS

摘要

A heat resistant negative working photosensitive composition that comprises (a) one or more polybenzoxazole precursor polymers (I): wherein x is an integer from about 10 to about 1000, y is an integer from 0 to about 900 and (x+y) is about less then 1000; Ar¹ is a tetravalent aromatic group, a tetravalent heterocyclic group, or mixtures thereof; Ar² is a divalent aromatic, a divalent heterocyclic, a divalent alicyclic, or a divalent aliphatic group that may contain silicon; Ar³ is a divalent aromatic group, a divalent aliphatic group, a divalent heterocyclic group, or mixtures thereof; Ar⁴ is Ar¹ (OH)₂ or Ar²; G is a monovalent organic group a carbonyl, carbonyloxy or sulfonyl group; (b) one or more photo-active compounds which release acid upon irradiation (PAGs); (c) one or more latent crosslinkers each of which contains at least two ~N-(CH₂OR)_n units (n=1 or 2, wherein R is a linear or branched C₁-C₈ alkyl group); (d) at least one solvent, and (e) at least one dissolution rate modifier, with the proviso that when the latent crosslinker is highly reactive, the dissolution rate modifier does not contain carboxylic acid groups.