| 摘要 |
An encapsulation process for a component based on an organic semiconductor uses a glass solder (6) of similar coefficient of thermal expansion to the substrate (2) and housing, mixes it with binder or solvent, seals the cover (5), removes the solvent, sinters and heats the glass locally using light of a given wavelength. An encapsulation process for a component based on an organic semiconductor comprises preparing a housing with connections using substrate (2), housing and glass solder (6) having thermal coefficients of expansion differing by less than 10e-6/K. The glass is mixed with a binder or solvent, sealed around the cover (5), the binder or solvent removed, the glass sintered and the substrate covered with the semiconductor component (3) and electrode layers (4,12). The cover (5) is applied and the glass locally heated by a light source at a given peak wavelength. |
