| 摘要 |
An electroless gold plating solution, characterized in that it comprises a non-cyanide water-soluble gold compound and a pyrosulfite compound. The electroless plating solution may further contain a sulfite compound or an aminocarboxylate compound. As a pyrosulfite compound, use can be made of pyrosulfurous acid, an alkali metal salt, an alkaline earth metal salt or an ammonium salt thereof, or the like. The electroless plating solution is low in toxicity, can be used at a pH near neutral, and the resulting gold plating exhibits good adhesion of a solder and a coating to it.
|
