| 摘要 |
The invention relates to a method for testing printed circuit boards, in particular empty printed circuit boards. The inventive method consists in automatically detecting the surface level of a tested board during a bonding process, the other bonding processes are controlled according to a detected level. In this manner, the control of the test probes of a finger tester is automatically adapted to the level, which is advantageous for testing flexible boards whose surface can be embodied in a three-dimensional shape.
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