发明名称 PREPARATION OF REBONDING FOAM
摘要 <p>PURPOSE:To obtain the object product efficiently, hygienically and inexpensively by a method wherein flexible polyurethane foam chips are heated and compressed over a specific compression magnification to bond foam chips together without adhesive. CONSTITUTION:Flexible polyurethane foam scrap in the form of chips is inserted into a mold of compressible structure, for example, and heated at 180-250 deg.C for 1-20min., compressed at the magnification of compression by which block foam having an apparent density over about 4.5 times as much as the means apparent density of said foam can be obtained and integrated to prepare the object product.</p>
申请公布号 JPS587335(A) 申请公布日期 1983.01.17
申请号 JP19810105901 申请日期 1981.07.07
申请人 ACHILLES CORP 发明人 ISHINO TAKAYOSHI;TOGAKI SHIGERU
分类号 B29C67/00;B29B11/00;B29B17/00;B29C44/00;B29C59/00;B29C67/20;C08J9/22 主分类号 B29C67/00
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