CLEANING AGENT FOR REMOVING SOLDER FLUX AND METHOD FOR CLEANING SOLDER FLUX

摘要

Disclosed is a cleaning agent exhibiting excellent cleaning performance even in cleaning of a flux for lead-free solders or a flux for high-melting-point solders and further exhibiting excellent rinsing characteristics in the following rinsing step wherein an alcohol solvent is used. Also disclosed is a method for cleaning a solder flux. A cleaning agent for removing a solder flux is constituted such that the content of a benzyl alcohol is within 70-99.9 weight% and the content of an amino alcohol is within 0.1-30 weight% in case when the content of a glycol compound is less than 1 weight% relative to the total amount, while the content of the benzyl alcohol is within 15-99 weight% and the content of the amino alcohol is within 0.1-30 weight% in case when the content of the glycol compound is 1-40 weight%. Such a cleaning agent is used for cleaning a flux for lead-free solders or a flux for high-melting-point solders.