发明名称 |
Forming an electrical contact on an electronic component |
摘要 |
A method of constructing an electrical contact on an electronic component comprises first forming a protruding electrically conducting stud at a contact location by wire bonding a metal wire to a contact pad of the component. The stud is then contacted with solder, without using a mask, so that a solder bump is deposited on and adheres to the metal stud to form a composite solder contact which is able to form with a contact of another component a solder joint which has good electrical and mechanical properties and which may be reliable fabricated at high density by a low cost method. An electronic component provided with such solder contacts and an electronics component package including such a component are also disclosed.
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申请公布号 |
US7015132(B2) |
申请公布日期 |
2006.03.21 |
申请号 |
US20020038291 |
申请日期 |
2002.01.02 |
申请人 |
AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH |
发明人 |
LAHIRI SYAMAL KUMAR;LEE RINUS TEK PO;ABU SAMAH ZURUZI BIN |
分类号 |
H01L21/44;H01L21/60;H01L23/485;H01L23/498;H05K3/34;H05K3/40 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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