发明名称 Article for polishing semiconductor substrates
摘要 A method and apparatus for using fixed abrasive polishing pads that contain posts for chemical mechanical polishing (CMP). The posts have different shapes, different sizes, different heights, different materials, different distribution of abrasive particles and different process chemicals. This invention also includes preconditioning fixed abrasive articles comprising a plurality of posts so that the posts have equal heights above the backing to achieve a uniform texture. This invention relates to improvements with respect to in situ rate measurement (ISRM) devices. The invention resides in providing a mechanical means, such as a notch, to determine when approaching the end of the abrasive web roll. The invention resides in coding the web throughout its length to enable determining the location of different portions of the web. This invention resides in providing perforations in the sides or end of the web for improved handling.
申请公布号 US7014538(B2) 申请公布日期 2006.03.21
申请号 US20030382079 申请日期 2003.03.05
申请人 APPLIED MATERIALS, INC. 发明人 TIETZ JAMES V.;LI SHIJIAN;BIRANG MANOOCHER;WHITE JOHN M.;ROSENBERG, LEGAL REPRESENTATIVE SANDRA L.;SCALES MARTY;EMAMI RAMIN
分类号 B24B37/00;B24D11/00;B24B37/04;B24B37/20;B24B53/007;B24B53/017;B24D3/00;B24D3/28;B24D3/34;B24D7/12;H01L21/302;H01L21/304 主分类号 B24B37/00
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