发明名称 |
Organometallic precursor mixture for forming metal alloy pattern and method of forming metal alloy pattern using the same |
摘要 |
An organometallic precursor mixture for forming a metal alloy pattern and a method of forming the metal alloy pattern using the same, wherein the metal alloy pattern having improved adhesive force to a substrate, heat resistance, and resistance to atmospheric corrosion can be readily formed using the organometallic precursor mixture by and exposing step without using a separate photosensitive resin.
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申请公布号 |
US7014979(B2) |
申请公布日期 |
2006.03.21 |
申请号 |
US20030440273 |
申请日期 |
2003.05.19 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
BYUN YOUNG HUN;HWANG SOON TAIK;YUN BYONG KI;SON HAE JUNG |
分类号 |
G03F7/00;C07F1/00;C23C8/02;C23C18/06;C23C18/08;C23C18/14;C23C26/00;C23C30/00;G02F1/1335;G03F7/004;G03F7/075;H01L21/288;H01L21/768;H05K3/10 |
主分类号 |
G03F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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