发明名称 Organometallic precursor mixture for forming metal alloy pattern and method of forming metal alloy pattern using the same
摘要 An organometallic precursor mixture for forming a metal alloy pattern and a method of forming the metal alloy pattern using the same, wherein the metal alloy pattern having improved adhesive force to a substrate, heat resistance, and resistance to atmospheric corrosion can be readily formed using the organometallic precursor mixture by and exposing step without using a separate photosensitive resin.
申请公布号 US7014979(B2) 申请公布日期 2006.03.21
申请号 US20030440273 申请日期 2003.05.19
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 BYUN YOUNG HUN;HWANG SOON TAIK;YUN BYONG KI;SON HAE JUNG
分类号 G03F7/00;C07F1/00;C23C8/02;C23C18/06;C23C18/08;C23C18/14;C23C26/00;C23C30/00;G02F1/1335;G03F7/004;G03F7/075;H01L21/288;H01L21/768;H05K3/10 主分类号 G03F7/00
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